Rise Optoelectronics (Hangzhou) Co.,Ltd.

Lithium Tantalate wafer SAW grade

Item No.: SLT
Usual or Fe doped / White or Black
Item                        3"           4"         6"
Cutting Type Typical 36°Y/38.73°Y/42°Y/48°Y/X112°Y etc
Tol (±mm)                0.2           0.3  0.3
Thickness (mm) ≥0.10 ≥0.15 ≥0.25
Primary flat (mm) 22±2 32±2 57.5/42±2
Description
Lithium Tantalate is used extensively in the telecoms market:
In mobile telephones and optical modulators. It is the material of choice for the manufacture of surface acoustic wave devices.
Black LT wafers are used in the manufacturing of substrates for RF type SAW devices, high frequency filters with a wide bandwidth.
These next generation substrates are necessary for handling high volume graphics applications for wireless communications such as "Bluetooth" etc.
Basic materials characteristics(including Fe Doped)  
Crystal symmetry Trigonal, 3m
Lattice constant, A a = 5.154       c = 13.783
Density, g/cm3 7.45
Melting point , °C 1650
Curie point , °C 603
Mohs hardness 6
Thermal expansion coefficient, 10-6/°C aa = 16   ac = 4
Dielectric Constant (@ 100 KHz) ea = 54    ec = 43
Refractive indices @ 633 nm no = 2.175   ne = 2.180
Pyroelectric Coefficient: -2.3 10-4 C/°C/m2


Specifications
item normal standard black super black yellow yellow black
colour white grey dark grey yellow dark yellow
Flexural strength   same slightly worse much much better much much better
3 points bending test(N) 14--23 13--20 9--15 >25 >25
static electricity prevention   much much better much much better slightly better much much better
bulk resistivity Ωcm (10-85℃) E+14--15 1--5E+11 4--1E+10 4.50E+13 0.5--5E+11
surface potential (kv) 4.5 <0.3 <0.2 3.5 <0.2
dicing   better better much much better much much better
curie temperature: Tc ℃ 603 603 603 603.5 603.5
endurance against high temperature   better much much better   much much better
 
Running Specs        
  Item 3" 4" 6"
  Cutting Type Typical 36°Y/38.73°Y/42°Y/48°Y/X112°Y etc
  Diameter(round or square) (mm) 76.2 100 150
  Tol(±mm) 0.2 0.3 0.3
  Thickness (mm) ≥0.10 ≥0.15 ≥0.25
  Primary flat (mm) 22±2 32±2 57.5/42±2
  LTV (5mmx5mm) (µm) < 1 < 1 < 1
  TTV (µm) < 1.5 < 1.5 < 3
  Bow (µm) ±15 ±20 ±30
  Warp (µm) ≤ 20 ≤ 25 ≤ 30
  PLTV (<0.5µm within 5*5mm)  % ≥95% ≥95% ≥95%
  Edge bevel According with IEC62276& SEMI M1.2 Standard
  Polished side Ra (nm) ≤1.5
  Back Side Ra (µm) general Ra:0.2-0.5 or polished  
  Customization acceptable      
 
               
 
 

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