| Basic materials characteristics | |||
| Density, g/cm3 | 2.65 | ||
| Melting point, °C | 1467 | ||
| Thermal conductivity, W/(m x K) (T = 25°C) | 10.7 (parallel to axis Z) | 6.2 (perpendicular to axis Z) | |
| Hardness (Mohs) | 7 | ||
| Dielectric ñ onstant at 30 MHz | 4.34 (parallel to axis Z) | 4.27 (perpendicular to axis Z) | |
| Young's modulus (E), GPa | 97.2 (parallel to axis Z) | 76.5 (perpendicular to axis Z) | |
| Chemical stability | insoluble in water | ||
| Diameter | Ø 1" / Ø 2" / Ø 3" / Ø 4"/ Ø 6"/ Ø 8" |
| Square size | 10x10/20x20/50x50/100x100mm/150 x150mm/200x200mm |
| Thickness | 0.05mm/0.1mm/0.2mm/0.3mm/0.4 mm / 0.5 mm or more |
| Angle cut | X cut / Y cut / YX cut / Z cut/AT-cut 36° / ST cut 42.75° |
| Surface | single side polished / double sides polished |
| Flat | SEMI.Std. flat or Notch |
| TTV | <= 5 um |
| Roughness | Ra <=10 A |
| Surface quality | 40 /20 |
| Package | cassette / jar |
